The H series is a manual station for a whole wafer, in 6, 8 and 12 inch. A pneumatic chuck and a large handwheel give fast travel and fine placement under 1 µm. The open modular platen takes DC, low-current, 1/f, failure-analysis, reliability, RF, and high-power, high-current or high-voltage kits.
Key Features
- Chuck travel published as 300 × 300 mm, resolution under 1.0 µm, flatness under 10 µm
- Coarse theta 360°, fine ±8.0°
- Z quick lift 3 mm, fine lift 0–13 mm at 2 µm or better
- Platen in three positions: 300 µm separation, 5 mm load, and 0–40 mm continuous
- Contact repeatability under ±1 µm
- Up to 8 DC and 4 RF micropositioners, magnetic or vacuum mount
Specifications
| Specification |
H6 |
H8 |
H12 |
| Wafer |
6 inch |
8 inch |
12 inch |
| Control |
Manual |
Manual |
Manual |
| Environment |
Open |
Open |
Open |
| Power |
220 V, 50–60 Hz |
220 V, 50–60 Hz |
220 V, 50–60 Hz |
| Chuck XY travel |
300 × 300 mm |
300 × 300 mm |
300 × 300 mm |
| XY resolution |
< 1.0 µm |
< 1.0 µm |
< 1.0 µm |
| Flatness |
< 10 µm |
< 10 µm |
< 10 µm |
| Theta |
360° coarse, ±8.0° fine |
360° coarse, ±8.0° fine |
360° coarse, ±8.0° fine |
The product page gives one outline for the series, 1046 × 987 × 828 mm, and a weight of about 400 kg. Chuck travel is published as 300 × 300 mm (12 in × 12 in).
Official product pages do not publish a downloadable datasheet. Contact us for the configuration and a quotation.