The X series is a semi-automatic wafer probe station for 6, 8 and 12 inch Si, GaN and SiC devices. It covers DC I-V and C-V, optical, RF and 1/f noise, and it can be fitted later for high-power wafer test, RF, a full-automatic loader and a temperature chuck.
The chuck moves at 70 mm/s or faster, with motion accuracy of 1 µm or better and an index time of 500 ms or less. A shielded chamber keeps leakage low, and the station can be opened so the whole chuck pulls out 370 mm for loading.
Key Features
- Semi-automatic, and it can still be driven by hand
- Automatic wafer alignment, mapping, die-size measurement and remote test data
- One-button RF probe calibration and four-axis chuck calibration
- Temperature stability better than ±0.08 °C
- Microscope with simultaneous 100X to 1000X views
- High-power, RF and fully automatic test are field upgrades, not separate models
Specifications
| Specification |
X6 |
X8 |
X12 |
| Wafer |
6 inch |
8 inch |
12 inch |
| Control |
Semi-automatic |
Semi-automatic |
Semi-automatic |
| Chuck speed |
≥70 mm/s |
≥70 mm/s |
≥70 mm/s |
| Motion accuracy |
≤1 µm |
≤1 µm |
≤1 µm |
| Index time |
≤500 ms |
≤500 ms |
≤500 ms |
| Temperature stability |
Better than ±0.08 °C |
Better than ±0.08 °C |
Better than ±0.08 °C |
| Optics |
100X–1000X |
100X–1000X |
100X–1000X |
| Power |
220 V, 50–60 Hz |
220 V, 50–60 Hz |
220 V, 50–60 Hz |
The current product page publishes one outline for the series, 1060 × 1610 × 1550 mm, and a weight of about 1500 kg. It does not publish a separate size for each wafer.
Official product pages do not publish a downloadable datasheet. Contact us for the configuration and a quotation.